Semiconductor device having stacked semiconductor chips and method for fabricating the same

ABSTRACT

A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C §119 to Korean Patent Application 10-2016-0074740 filed on Jun.15, 2016, the disclosure of which is incorporated by reference herein inits entirety.

TECHNICAL FIELD

Exemplary embodiments of the present inventive concept relate to asemiconductor device, and more particularly to a semiconductor devicehaving stacked semiconductor chips and a method for fabricating thesame.

DISCUSSION OF RELATED ART

Semiconductor devices may have relatively high capacity, and may berelatively thin and relatively small. One approach of various packagetechniques is a packaging technique which vertically stacks a pluralityof semiconductor chips to form a relatively high density semiconductorchip package. Stacked semiconductor chips having various functions maybe integrated in a relatively small area.

SUMMARY

One or more exemplary embodiments of the present inventive conceptprovide a semiconductor device having relatively high mechanicalendurance. A semiconductor device according to one or more exemplaryembodiments of the present inventive concept may include an adhesivestructure serving as an under-fill.

One or more exemplary embodiments of the present inventive conceptprovide a method for fabricating a semiconductor device, which mayeliminate an extension of an adhesive structure covering stackedsemiconductor chips in the semiconductor device.

According to one or more exemplary embodiments of the present inventiveconcept, a method for manufacturing a semiconductor device includesstacking, on a package substrate, first semiconductor chips horizontallyspaced apart from each other. Each of the first semiconductor chipsincludes a first adhesive film facing the package substrate. The methodincludes stacking, respectively on the first semiconductor chips, secondsemiconductor chips horizontally spaced apart from each other. Each ofthe second semiconductor chips includes a second adhesive film facingthe first semiconductor chip. The method includes compressing the firstadhesive film and the second adhesive film to form an adhesivestructure. The adhesive structure includes an extension disposed onsidewalls of the first semiconductor chip and sidewalls of the secondsemiconductor chip. The method includes removing the extension from thesidewalls of the second semiconductor chips. The method includes forminga first molding layer substantially covering the first and secondsemiconductor chips. The method includes performing a cutting process onthe package substrate between the first and second semiconductor chipsto form a plurality of semiconductor packages each including at leastone of the first semiconductor chips and at least one of the secondsemiconductor chips.

According to one or more exemplary embodiments of the present inventiveconcept, a method for manufacturing a semiconductor device includesforming, on a package substrate, a plurality of stack structureshorizontally spaced apart from each other, each of the stack structuresincluding a plurality of semiconductor chips vertically stacked. Themethod includes forming adhesive structures respectively filling pacesbetween adjacent stack structures of the plurality of stack structures.The method includes removing a least a portion of the adhesive structurebetween the adjacent stack structures. Forming the stack structure andthe adhesive structures includes sequentially stacking and compressingthe plurality of semiconductor chips each including an adhesive filmdisposed on a surface of the semiconductor chip facing the packagesubstrate.

According to one or more exemplary embodiments of the present inventiveconcept, a semiconductor device includes a first semiconductor chipstacked on a package substrate and including a first through via. Asecond semiconductor chip is stacked on the first semiconductor chip andincludes a second through via. A first interconnect member is disposedbetween the package substrate and the first semiconductor chip andelectrically connected to the first through via. A second interconnectmember is disposed between the first semiconductor chip and the secondsemiconductor chip and electrically connected to the second through via.A first adhesive layer substantially fills a first space between thepackage substrate and the first semiconductor chip and substantiallycovers the first interconnect member. A second adhesive layersubstantially fills a second space between the first semiconductor chipand the second semiconductor chip and substantially covers the secondinterconnect member. At least one of the first and second adhesivelayers includes a recessed sidewall that is recessed toward one of thefirst and second interconnect members.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the inventive concept will become moreapparent by describing in detail exemplary embodiments thereof, withreference to the accompanying drawings, in which:

FIGS. 1, 2, 4, and 6 to 13 are cross-sectional views illustrating amethod for fabricating a semiconductor device according to someexemplary embodiments of the present inventive concept.

FIG. 3 is a plan view illustrating a portion of a first semiconductorchip depicted in FIG. 2.

FIG. 5A is an enlarged view of section M of FIG. 4.

FIG. 5B is a plan view illustrating a portion of a first semiconductorchip depicted in FIG. 4.

FIG. 14 is a cross-sectional view illustrating a method formanufacturing a semiconductor device according to a comparative example.

FIG. 15 is a plan view illustrating a top surface of a semiconductorpackage depicted in FIG. 14.

FIGS. 16 to 19 are cross-sectional views illustrating a method formanufacturing a semiconductor device according to some exemplaryembodiments of the present inventive concept.

FIGS. 20, 23 and 24 are cross-sectional views illustrating a method formanufacturing a semiconductor device according to some exemplaryembodiments of the present inventive concept.

FIG. 21 is a flow chart illustrating a wet etch process according tosome exemplary embodiments of the present inventive concept.

FIGS. 22A to 22D are enlarged cross-sectional views of section N of FIG.20.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIGS. 1, 2, 4, and 6 to 13 are cross-sectional views illustrating amethod for fabricating a semiconductor device according to someexemplary embodiments of the present inventive concept. FIG. 3 is a planview illustrating a portion of a first semiconductor chip depicted inFIG. 2. FIG. 5A is an enlarged view of section M of FIG. 4. FIG. 5B is aplan view illustrating a portion of a first semiconductor chip depictedin FIG. 4.

Referring to FIG. 1, a package substrate 100 may be adhered to a carriersubstrate CR. For example, the carrier substrate CR and the packagesubstrate 100 may be adhered to each other by an adhesive mold MOdisposed between the carrier substrate CR and the package substrate 100.The package substrate 100 may include first to third regions RG1, RG2and RG3; however, exemplary embodiments of the present inventive conceptare not limited thereto. In an exemplary embodiment of the presentinventive concept, the package substrate 100 may include regions inaddition to the first to third regions RG1, RG2 and RG3. The packagesubstrate 100 may include (e.g., on a bottom surface of the packagesubstrate 100) outer interconnect members 102. For example, the outerinterconnect members 102 may be solder balls, which may include tin,lead, or copper. The package substrate 100 may include landing pads 104on a top surface of the package substrate 100.

As an example, the carrier substrate CR may be a silicon wafer or aglass substrate, and the package substrate 100 may be a printed circuitboard (PCB). The package substrate 100 may include one or more throughvias through which the outer interconnect members 102 and the landingpads 104 are vertically connected to each other.

Referring to FIG. 2, first semiconductor chips 120 may be respectivelypositioned in the first to third regions RG1, RG2 and RG3 of the packagesubstrate 100. The first semiconductor chips 120 may be horizontallyspaced apart from each other at substantially a same level as eachother. Each of the first semiconductor chips 120 may be stacked on thepackage substrate 100 in a face-down state where a first active surface120 a faces the package substrate 100. As an example, the firstsemiconductor chips 120 may be substantially simultaneously adhere tothe package substrate 100 using a head 106 having a bottom surfaceloaded with the first semiconductor chips 120. A head film 108 may bedisposed between the head 106 and the first semiconductor chips 120. Forexample, the head film 108 may include a release film that canfacilitate detachment the first semiconductor chips 120 from the head106. The first semiconductor chips 120 may each be substantially a sametype of chip. As an example, the first semiconductor chips 120 may eachhave substantially the same size and may perform substantially the samefunctions.

A single first semiconductor chip 120 will be described in more detailbelow with reference to FIG. 3. Referring to FIGS. 2 and 3, the firstsemiconductor chip 120 may include the first active surface 120 a onwhich a first circuit layer 122 may be disposed and a first inactivesurface 120 b opposite the first active surface 120 a. For example, thefirst semiconductor chip 120 may be a memory chip. The firstsemiconductor chip 120 may include through vias 124 electricallyconnected to the first circuit layer 122. For example, at least one ofthe first through vias 124 may be a through silicon via (TSV). The firstthrough vias 124 may be disposed in a central region 120 c of the firstsemiconductor chip 120. In an exemplary embodiment of the presentinventive concept, the central region 120 c may have a cross shape. Inthe first circuit layer 122, the central region 120 c may be aperipheral circuit region and other regions except the central region120 c may be memory cell regions.

The first semiconductor chip 120 may include first to fourth sidewalls120 y, 120 z, 120 w and 120 x. The first and second sidewalls 120 y and120 z may face each other, and the third and fourth sidewalls 120 w and120 x may face each other. A distance between the first and secondsidewalls 120 y and 120 z may be a width in a first direction of thefirst semiconductor chip 120, and a distance between the third andfourth sidewalls 120 w and 120 x may be a width in a second directioncrossing the first direction of the first semiconductor chip 120. Thewidth in the first direction may be substantially the same as the widthin the second direction crossing the first direction; however, exemplaryembodiments of the present inventive concept are not limited thereto,and the widths may be different from each other.

First interconnect members 112, such as solder balls or solder bumps,may be disposed on the first active surface 120 a of the firstsemiconductor chip 120. The first semiconductor chip 120 may beelectrically connected to the package substrate 100 through the firstinterconnect members 112. First backside pads 132 may be disposed on thefirst inactive surface 120 b of the first semiconductor chip 120. Thefirst backside pads 132 may be electrically connected to the firstthrough vias 124. For example, the first interconnect members 112 andthe first backside pads 132 may be vertically connected to each otherthrough the first through vias 124.

A first non-conductive film 140 may be adhered to the first activesurface 120 a of the first semiconductor chip 120. The firstnon-conductive film 140 may be an epoxy-based adhesive film including noconductive particles. For example, the first non-conductive film 140 maybe cured at a temperature of about 100° C. of higher. The firstnon-conductive film 140 may have a first thickness T1. The firstthickness T1 may be substantially the same as or greater than aprotruding length of the first interconnect members 112. As an example,the first non-conductive film 140 may cover the first interconnectmembers 112 and substantially completely fill a space between the firstinterconnect members 112. The first non-conductive film 140 might not beelectrically conductive.

Referring to FIGS. 4, 5A and 5B, the first semiconductor chips 120stacked on the package substrate 100 may be compressed to form firstadhesive layers as1 respectively on the first to third regions RG1, RG2and RG3. The first semiconductor chips 120 may be compressed such thatthe first interconnect members 112 may respectively contactsubstantially an entire upper surface of a respective one of the landingpads 104 of the package substrate 100. Thus, the package substrate 100and the first semiconductor chips 120 may be electrically connected toeach other.

The first semiconductor chips 120 may be compressed at substantially thesame time when the first semiconductor chips 120 are stacked on thepackage substrate 100. The compression of the first semiconductor chips120 may include performing a thermocompression where heat and pressureare applied to the first semiconductor chips 120 and the firstnon-conductive films 140. As an example, the first semiconductor chip120 may receive pressure from the head 106 at a temperature greater thanthe cure temperature of the first non-conductive films 140. For example,the thermocompression may include applying force of from about 10N toabout 100N against the first semiconductor chips 120 at a temperature offrom about 80° C. to about 300° C.

The first non-conductive films 140 may be compressed to respectivelyform the first adhesive layers as1. Each of the first adhesive layersas1 may fill a first space SP1 between the first semiconductor chip 120and the package substrate 100. The first adhesive layers as1 may includea first sub-extension as1 e covering the first to fourth sidewalls 120y, 120 z, 120 w and 120 x of the first semiconductor chip 120.

As an example, after the thermocompression, a first distance D1 may beachieved between the first active surface 120 a of the firstsemiconductor chip 120 and the top surface of the package substrate 100,and the first distance D1 may be less than the first thickness T1 of thefirst non-conductive film 140. As an example, the thermocompression mayreduce the thickness of the first non-conductive film 140 so that afillet may protrude outside the first semiconductor chip 120 from thefirst non-conductive film 140. The protruded fillet may be cured to formthe first sub-extension as1 e. The first sub-extension as1 e mayvertically extend along the first to fourth sidewalls 120 y, 120 z, 120w and 120 x and contact the head film 108. The head film 108 may preventthe first sub-extension as1 e from covering the first inactive surface120 b of the first semiconductor chip 120.

Referring to FIG. 6, second semiconductor chips 220 may be stackedrespectively on the first semiconductor chips 120. Each of the secondsemiconductor chips 220 may include a second active surface 220 a onwhich a second circuit layer 222 is formed and a second inactive surface220 b opposite the second active surface 220 a. The second semiconductorchip 220 may include second through vias 224 penetrating through thesecond semiconductor chip 220 that are electrically connected to thesecond circuit layer 222, second interconnect members 212 on the secondactive surface 220 a, and second backside pads 232 on the secondinactive surface 220 b. For example, the second semiconductor chips 220may be substantially the same chips as the first semiconductor chips 120described in more detail above. Thus, duplicative descriptions may beomitted.

A second non-conductive film 240 may be adhered onto the second activesurface 220 a of each of the second semiconductor chips 220. The secondnon-conductive film 240 may be an epoxy-based adhesive film including noconductive particles, and may be substantially the same film as thefirst non-conductive film 140 discussed in more detail above. The secondnon-conductive film 240 might not be electrically conductive.

Each of the second semiconductor chips 220 may be stacked on the firstsemiconductor chip 120 in a face-down state where the second activesurface 220 a faces the first semiconductor chip 120. As an example, thesecond semiconductor chips 220 may be substantially simultaneouslystacked on the first semiconductor chips 120 using the head 106 whosefloor surface is loaded with the second semiconductor chips 220. Thesecond semiconductor chips 220 may be horizontally spaced apart fromeach other at substantially the same level.

Referring to FIG. 7, the second semiconductor chips 220 on the firstsemiconductor chips 120 may be compressed to form second adhesive layersas2 respectively on the first to third regions RG1, RG2 and RG3. Thesecond semiconductor chips 220 may be compressed such that the secondinterconnect members 212 may respectively contact substantially anentire upper surface of a respective one of the first backside pads 132of the first semiconductor chips 120. Thus, the first semiconductorchips 120 and the second semiconductor chips 220 may be electricallyconnected to each other.

The second semiconductor chips 220 may be compressed at substantiallythe same time when the second semiconductor chips 220 are stacked on thefirst semiconductor chips 120. The compression of the secondsemiconductor chips 220 may include performing a thermocompression. Thecompression of the second semiconductor chips 220 may be substantiallythe same as the compression of the first semiconductor chips 120.

Each of the second adhesive layers as2 may fill a second space SP2between the first semiconductor chip 120 and the second semiconductorchip 220. The second adhesive layer as2 may include a secondsub-extension as2 e covering sidewalls of the second semiconductor chip220. The second sub-extension as2 e may be a cured fillet that protrudesoutside the second semiconductor chip 220 from the second non-conductivefilm 240 when the second semiconductor chip 220 is compressed. The firstadhesive layer as1 and the second adhesive layer as2 may be integrallyconnected to each other.

Referring to FIG. 8, third semiconductor chips 320 may be stackedrespectively on the second semiconductor chips 220. Each of the thirdsemiconductor chips 320 may include a third active surface 320 a onwhich a third circuit layer 322 is formed and a third inactive surface320 b opposite the third active surface 320 a. The third semiconductorchip 320 may include third interconnect members 312 on the third activesurface 320 a. The third interconnect members 312 need not be verticallyaligned with the second through vias 224. In an exemplary embodiment ofthe present inventive concept, the third semiconductor chip 320 mightnot include through vias; however, exemplary embodiments of the presentinventive concept are not limited thereto. Each of the thirdsemiconductor chips 320 may be a memory chip. For example, the thirdsemiconductor chips 320 may each have a thickness greater than those ofthe first and second semiconductor chips 120 and 220.

A third non-conductive film may be adhered onto the third active surface320 a of each of the third semiconductor chips 320. The thirdnon-conductive film may be an epoxy-based adhesive film including noconductive particles, and may be substantially the same film as thefirst non-conductive film 140 discussed in more detail above. The thirdnon-conductive film might not be electrically conductive.

Each of the third semiconductor chips 320 may be stacked on the secondsemiconductor chip 220 in a face-down state where the third activesurface 320 a faces the second semiconductor chip 220. As an example,the third semiconductor chips 320 may be substantially simultaneouslystacked on the second semiconductor chips 220 using the head 106 whosefloor surface is loaded with the third semiconductor chips 320. Thethird semiconductor chips 320 may be horizontally spaced apart from eachother at substantially the same level.

When the third semiconductor chips 320 are stacked, the thirdsemiconductor chips 320 may be compressed to form third adhesive layersas3 respectively on the first to third regions RG1, RG2 and RG3. Thethird semiconductor chips 320 may be compressed such that the thirdinterconnect members 312 contact substantially an entire upper surfaceof a respective one of the second backside pads 232 of the secondsemiconductor chips 220. As an example, the second semiconductor chips220 and the third semiconductor chips 320 may be electrically connectedto each other. Thus, the sequentially stacked first to thirdsemiconductor chips 120, 220 and 320 may be vertically connected to eachother and may form a single stack structure SS. A plurality of stackstructures SS may be formed respectively in the first to third regionsRG1, RG2 and RG3.

The compression of the third semiconductor chips 320 may includeperforming a thermocompression. The compression of the thirdsemiconductor chips 320 may be substantially the same as the compressionof the first semiconductor chips 120.

Each of the third adhesive layers as3 may fill a third space SP3 betweenthe third semiconductor chip 320 and the second semiconductor chips 220.The third adhesive layer as3 may include a third sub-extension as3 ecovering sidewalls of the third semiconductor chip 320. The thirdsub-extension as3 e may be a cured fillet that protrudes outside thethird semiconductor chip 320 from the third non-conductive film when thethird semiconductor chip 320 is compressed.

The sequentially stacked first to third adhesive layers as1, as2 and as3may be integrally connected to each other to form a single adhesivestructure AS. The adhesive structure AS may include an extension ASecovering sidewalls of the stack structure SS, and the extension ASe mayinclude the first to third sub-extensions as1 e, as2 e and as3 e.

Additional semiconductor chips may be stacked before the thirdsemiconductor chips 320 are stacked. As an example, the stack structureSS according to an exemplary embodiment of the present inventive conceptmay include more than three stacked semiconductor chips. Alternatively,for example, the second semiconductor chips 220 may be omitted. As anexample, the stack structure SS according to an exemplary embodiment ofthe present inventive concept may include two stacked semiconductorchips.

In a method for manufacturing a semiconductor device according to anexemplary embodiment of the present inventive concept of the presentinventive concept, the non-conductive films 140 and 240 may be used tostack and bond the semiconductor chips 120, 220 and 320 on the packagesubstrate 100, and thus it may be possible to achieve a relatively finepitch between the interconnect members 112, 212 and 312 without anelectrical short between the interconnect members 112, 212 and 312adjacent to each other. The adhesive structure AS formed from thenon-conductive films 140 and 240 may serve as an under-fill thatsubstantially fills the first to third spaces SP1, SP2 and SP3, thusincreasing mechanical endurance of the interconnect members 112, 212 and312.

Referring to FIG. 9, a first molding layer 500 may be formed to coverthe stack structures SS. Since the adhesive structure AS may serve as anunder-fill that substantially fills the first to third spaces SP1, SP2and SP3, the first molding layer 500 may be formed without performing aMUF (molded under-fill) process. For example, the first molding layer500 may be formed to substantially completely cover the third inactivesurfaces 320 b of the third semiconductor chips 3230.

The first molding layer 500 may include a molding composition having arelatively low viscosity and a relatively high gap-fill property, andmay thus substantially fill spaces between the stack structures SS.Thus, spaces between the structures SS that are irregular and relativelynarrow, for example due to the extensions ASe of the adhesive structuresAS, may be filled.

Referring to FIG. 10, the first molding layer 500 between the thirdsemiconductor chips 320 may be cut to remove the extensions ASe disposedin spaces between the third semiconductor chips 320. As an example, aportion of each of the extensions ASe may be removed and the removedportion of the extension ASe may be the third sub-extension as3 e.

As an example, a first blade BL1 may be used to cut between the thirdsemiconductor chips 320. The first molding layer 500 between the thirdsemiconductor chips 320 may be removed together with the extensions ASebetween the third semiconductor chips 320. The first blade BL1 may havea first width W1. For example, the first width W1 may be substantiallythe same as a distance between the third semiconductor chips 320. Theremoval of the first molding layer 500 and the extensions ASe betweenthe third semiconductor chips 320 may define first recess regions RS1between the third semiconductor chips 320.

In an exemplary embodiment of the present inventive concept, theextensions ASe between the first semiconductor chips 120 and between thesecond semiconductor chips 220 need not be removed. In an exemplaryembodiment of the present inventive concept, the cutting process mayremove at least a portion of the extensions ASe between the firstsemiconductor chips 120 and between the second semiconductor chips 220.The remaining, not removed, first molding layer 500 may form firstmolding patterns 505 filling between the stack structures SS.

Referring to FIG. 11, a second molding layer 550 may be formed on theremaining first molding layer 500. The second molding layer 550 may fillthe first recess regions RS1. For example, the second molding layer 550may include a material different from that of the first molding layer500. As an example, the second molding layer 550 may include aninorganic substance whose content is greater than that of the firstmolding layer 500 and may include an organic substance whose content isless than that of the first molding layer 500. Thus, the second moldinglayer 550 may have a thermal expansion coefficient less than that of thefirst molding layer 500. As an example, a molding composition of thesecond molding layer 550 may have a higher inorganic content than thefirst molding layer 500 such that the second molding layer 550 may havea relatively high viscosity and a relatively poor gap-fill property.However, the first recess regions RS1 may have a substantially uniformlyshaped space and a relatively wide width such that the moldingcomposition of the second molding layer 550 may fill the first recessregions RS1. As an example, the second molding layer 550 may include thesame material as the first molding layer 500; however, exemplaryembodiments of the present inventive concept are not limited thereto.

Referring to FIG. 12, the second molding layer 550 and the first moldinglayer 500 may be planarized until exposing the third inactive surfaces320 b of the third semiconductor chips 320 and thus second moldingpatterns 555 may be formed. The second molding patterns 555 mayrespectively substantially fill the second regions RS2. The firstmolding layer 500 may be substantially completely removed from on thethird semiconductor chips 320.

Through the planarization process, the third inactive surfaces 320 b ofthe third semiconductor chips 320 may be substantially aligned with topsurfaces of the second molding patterns 555. When the third inactivesurfaces 320 b are exposed to an outside of the first to thirdsemiconductor chips 120, 220 and 320, heat may be removed from the firstto third semiconductor chips 120, 220 and 320.

The carrier substrate CR may be detached from the package substrate 100by removing the adhesive mold MO from between the carrier substrate CRand the package substrate 100.

Referring to FIG. 13, a cutting process may be performed on the packagesubstrate 100 to form a plurality of semiconductor packages. As anexample, a second blade BL2 may be used to cut between the first tothird regions RG1, RG2 and RG3 of the package substrate 100. The firstto third regions RG1, RG2 and RG3 may thus be separated from each other.The cutting process may cut the first and second molding patterns 505and 555 between the stack structures SS. A single semiconductor packagemay be formed including the stack structure SS on one of the first tothird regions RG1, RG3 and RG3 through the cutting process. The secondblade BL2 may have a second width W2. The second width W2 may be lessthan the first width W1.

FIG. 14 is a cross-sectional view illustrating a method formanufacturing a semiconductor device according to a comparative example.FIG. 15 is a plan view illustrating a top surface of the semiconductorpackage of FIG. 14.

In a method of manufacturing a semiconductor device, the extensions ASemight not be removed from between the third semiconductor chips 320. Thestack structure SS may be covered only with the first molding pattern505. The extension ASe of the adhesive structure AS may be disposedbetween the third semiconductor chip 320 and the first molding pattern505. The extension ASe may have a top surface that is substantiallyaligned with the third inactive surface 320 b of the third semiconductorchip 320. As an example, the top surface of the extension ASe may beexternally exposed between the third semiconductor chip 320 and thefirst molding pattern 505. The exposed extension ASe may display anirregular shape on a top surface of the semiconductor package.

In a method for manufacturing a semiconductor device according to anexemplary embodiment of the present inventive concept, the adhesivestructure AS may have no externally exposed extension ASe and may notdisplay an irregular shape on a top surface of the semiconductorpackage. Upper and lower portions of the semiconductor package mayinclude the first and second molding patterns 505 and 555, respectively,whose materials may be different from each other. As an example, thesecond molding pattern 555 may have a relatively low thermal expansioncoefficient, and thus it may be possible to reduce or eliminateheat-induced warpage of the semiconductor package.

A semiconductor device according to an exemplary embodiment of thepresent inventive concept will be described in more detail below withreference to FIG. 13.

Referring to FIG. 13, the stack structure SS may be disposed on thepackage substrate 100. For example, the package substrate 100 may be aprinted circuit board (PCB). The package substrate 100 may have a bottomsurface including outer interconnect members 102 such as solder ballsand a top surface including landing pads 104. The package substrate 100may include at least one through via.

The stack structure SS may include first to third semiconductor chips120, 220 and 230 that may be sequentially stacked. The firstsemiconductor chip 120 may include first through vias 124 electricallyconnected to a first circuit layer 122, and the second semiconductorchip 220 may include second through vias 224 electrically connected to asecond circuit layer 222. The third semiconductor chip 320 might notinclude through vias; however, exemplary embodiments of the presentinventive concept are not limited thereto. In an exemplary embodiment ofthe present inventive concept, the first to third semiconductor chips120, 220 and 320 may each be memory chips.

As an example, the first to third semiconductor chips 120, 220 and 320may have substantially the same planar shape and size as each other. Thethird semiconductor chip 320 may have a greater thickness than the firstand second semiconductor chips 120 and 220; however, exemplaryembodiments of the present inventive concept are not limited thereto.

First interconnect members 112 such as solder balls or solder bumps maybe disposed on the first active surface 120 a of the first semiconductorchip 120. The first semiconductor chip 120 may be electrically connectedto the package substrate 100 through the first interconnect members 112.The first semiconductor chip 120 may include first backside pads 132disposed on the first inactive surface 120 b of the first semiconductorchip 120. The first backside pads 132 may be electrically connected tothe first through vias 124.

Second interconnect members 212 such as solder balls or solder bumps maybe disposed on the second active surface 220 a of the secondsemiconductor chip 220. The second semiconductor chip 220 may beelectrically connected to the first semiconductor chip 120 through thesecond interconnect members 212. The second semiconductor chip 220 mayinclude second backside pads 232 disposed on the second inactive surface220 b of the second semiconductor chip 220. The second backside pads 232may be electrically connected to the second through vias 224.

Third interconnect members 312 such as solder balls or solder bumps maybe disposed on a third active surface 320 a of the third semiconductorchip 320. The third semiconductor chip 320 may be electrically connectedto the second semiconductor chip 220 through the third interconnectmembers 312. Thus, the package substrate 100 and the first to thirdsemiconductor chips 120, 220 and 320 may be vertically and electricallyconnected to each other.

An adhesive structure AS may fill the first space SP1 between thepackage substrate 100 and the first semiconductor chip 120, the secondspace SP2 between the first and second semiconductor chips 120 and 220,and the third space SP3 between the second and third semiconductor chips220 and 320. The adhesive structure AS may bond the first to thirdsemiconductor chips 120, 220 and 320 to the package substrate 100. Theadhesive structure AS may fill between the first to third interconnectmembers 112, 212 and 312 adjacent to each other such that the first tothird interconnect members 112, 212 and 312 may be insulated from eachother.

The adhesive structure AS may include the extension ASe coveringsidewalls of the first and second semiconductor chips 120 and 220. Aportion of the adhesive structure AS may be the extension ASe protrudingoutward from outer sides of the first and second semiconductor chips 120and 220. The extension ASe may cover only the sidewalls of the firstsemiconductor chip 120; however, exemplary embodiments of the presentinventive concept are not limited thereto.

The package substrate 100 may include the first molding pattern 505 andthe second molding pattern 555 covering the stack structures SS. Thesecond molding pattern 555 may be disposed on the first molding pattern505 and may cover sidewalls of the third semiconductor chip 320. Thefirst molding pattern 505 may cover sidewalls of the extension ASe. Forexample, the second molding pattern 555 may have a thermal expansioncoefficient less than that of the first molding pattern 505. Thus, thesecond molding pattern 555 may reduce or eliminate heat-induced warpageof the semiconductor package.

The second molding pattern 555 may have a top surface that issubstantially aligned with the third inactive surface 320 b of the thirdsemiconductor chip 320. The third inactive surface 320 b of the thirdsemiconductor chip 320 may thus be exposed to an outside of the first tothird semiconductor chips 120, 220 and 320. Thus, it may be possible toremove heat generated from the first to third semiconductor chips 120,220 and 320.

FIGS. 16 to 19 are cross-sectional views illustrating a method formanufacturing a semiconductor device according to some exemplaryembodiments of the present inventive concept. Technical featuresdescribed below with reference to FIGS. 16 to 19 may be substantiallythe same as those discussed above with reference to FIGS. 1 to 13, andthus duplicative descriptions may be omitted.

Referring to FIG. 16, a cutting process may be carried out on aresultant structure (e.g., the resultant structure described withreference to FIG. 9) to remove the extensions ASe disposed in spacesbetween the stack structures SS. As an example, the first blade BL1 maybe used to cut between the stack structures SS. The cutting process maybe performed until partially exposing the top surface of the packagesubstrate 100. The extensions ASe may thus be substantially completelyremoved from between the stack structures SS. Alternatively, at leastone of the first molding layer 500 and the extension ASe may partiallyremain between the stack structures SS; however, exemplary embodimentsof the present inventive concept are not limited thereto.

As the cutting process removes the first molding layer 500 and theextensions ASe between the stack structures SS, second recess regionsRS2 may be defined. When the cutting process is terminated, the first tothird adhesive layers as1, as2 and as3 of the adhesive structure AS maybe separated and vertically spaced apart from each other.

Referring to FIG. 17, the second molding layer 550 may be formed tocover the stack structures SS. The second molding layer 550 may beformed to fill the second recess regions RS2. The second recess regionsRS2 may have a substantially uniform shape and a relatively wide widthsuch that the molding composition of the second molding layer 550 mayfill the second recess regions RS2.

Referring to FIG. 18, the second molding layer 550 and the first moldinglayer 500 may be planarized until exposing the third inactive surfaces320 b of the third semiconductor chips 320 and thus second moldingpatterns 555 may be formed. The carrier substrate CR may be detachedfrom the package substrate 100 by removing the adhesive mold MO frombetween the carrier substrate CR and the package substrate 100.

Referring to FIG. 19, a cutting process may be performed on the packagesubstrate 100 to form a plurality of semiconductor packages. The cuttingprocess may be performed using the second blade BL2.

According to an exemplary embodiment of the present inventive concept,it may be possible to substantially completely remove the extension ASeof the adhesive structure AS. Thus, the adhesive structure AS may haveno externally exposed extension ASe and may not display an irregularshape on a top surface of the semiconductor package. The second moldingpattern 555 may have a relatively low thermal expansion coefficient, andthus it may be possible to reduce or eliminate heat-induced warpage ofthe semiconductor package.

A semiconductor device according to an exemplary embodiment of thepresent inventive concept will be described in more detail below withreference to FIG. 19. Technical features described below with referenceto FIG. 19 may be substantially the same as those discussed above withreference to FIG. 13, and thus duplicative descriptions may be omitted.

Referring to FIG. 19, the adhesive structure AS may include the first tothird adhesive layers as1, as2 and as3. The first to third adhesivelayers as1, as2 and as3 may respectively substantially fill the first tothird spaces SP1, SP2 and SP3. The first to third adhesive layers as1,as2 and as3 may be separated and vertically spaced apart from eachother.

The package substrate 100 may include the second molding pattern 555covering the stack structures SS. For example, the second moldingpattern 555 may be in direct contact with sidewalls of the first tothird semiconductor chips 120, 220 and 320. The second molding pattern555 may be in direct contact with sidewalls of the first to thirdadhesive layers as1, as2 and as3.

FIGS. 20, 23 and 24 are cross-sectional views illustrating a method formanufacturing a semiconductor device according to some exemplaryembodiments of the present inventive concept. FIG. 21 is a flow chartillustrating a wet etch process according to some exemplary embodimentsof the present inventive concept. FIGS. 22A to 22D are enlargedcross-sectional views of section N of FIG. 20. Technical featuresdescribed below with reference to FIGS. 20, 21, 22A, 22B, 22C, 22D, 23and 24 may be substantially the same as those discussed above withreference to FIGS. 1 to 13, and thus duplicative descriptions may beomitted.

Referring to FIG. 20, a wet etch process WE process may be carried outon a resultant structure (e.g., the resultant structure described withreference to FIG. 8) to remove the extensions ASe disposed in spacesbetween the stack structures SS. As an example, the wet etch process WEmay include introducing an etch solution into spaces between the stackstructures SS to selectively wet etch the extensions ASe. The extensionsASe may thus be substantially completely removed from between the stackstructures SS. Alternatively, the extensions ASe may partially remainbetween the stack structures SS; however, exemplary embodiments of thepresent inventive concept are not limited thereto. As an example, thefirst molding layer 500 need not be formed.

Referring to FIGS. 20, 21 and 22A, the wet etch process WE may includeapplying alkaline solution to swell an extension of an adhesivestructure (S110). For example, the wet etching process WE may includeapplying an alkaline solution 610 onto the extension ASe between thestack structures SS. The alkaline solution 610 may be applied onto theextension ASe through a space between the stack structures SS. Thealkaline solution 610 may swell a resin included in the extension ASe.For example, the alkaline solution 610 may include a sodium hydroxidesolution.

Referring to FIGS. 20, 21 and 22B, the wet etch process WE may includeapplying an oxidant to decompose resin contained in an extension (S120).For example, the wet etch process WE may include applying an oxidant 620onto the extension ASe between the stack structures SS. The oxidant 620may effectively decompose the swollen resin included in the extensionASe. For example, the oxidant 620 may include potassium permanganate. Asan example, the extension ASe may be decomposed based on an etchprinciple given by Reaction 1 below.

CH₄+12MnO₄ ⁻+14OH⁻→CO₃ ²⁻+12MnO₄ ²⁻+9H₂O+O₂

2MnO₄ ²⁻+2H₂O→MnO₂+OH⁻+O₂  [Reaction 1]

Referring to FIGS. 20, 21 and 22C, the wet etch process WE may includeapplying reductant to reduce a residual product to water-soluble (S130).The wet etch process may include applying a reductant 630 onto aresidual product RP remaining between the stack structures SS. After theoxidant 620 decomposes the resin included in the extension ASe, theremay remain the residual product 620 including an unreacted oxidant 620.Thus, the reductant 630 may be applied to reduce the residual product RPto water-soluble. For example, the reductant 630 may include hydrogenperoxide and/or hydroxylamine, and the residual product RP may includemanganese oxide. As an example, the residual product RP may be reducedto water-soluble based on a reduction principle expressed by Reaction 2below.

MnO₂+4H⁺+2e ⁻→Mn²⁺+2H₂O

H₂O₂→2H⁺+2e ⁻+O₂

2NH₂OH→4H⁺+2H₂O+2e ⁻+N₂  [Reaction 2]

Referring to FIGS. 20, 21 and 22D, the wet etch process WE may includewater washing to remove a residue (S140). The wet etch process mayinclude performing a water washing 640 to remove a residue between thestack structures SS. Since the residual product RP is reduced towater-soluble in the previous process, the water washing 640 maysubstantially completely remove the residue. Thus, the extension ASe maybe substantially completely removed and the first to third adhesivelayers as1, as2 and as3 of the adhesive structure AS may be separatedand vertically spaced apart from each other. Since the extension ASe maybe removed by the wet etch process WE or an isotropic etch process, arecessed sidewall may be formed on at least one of the first to thirdadhesive layers as1, as2 and as3. For example, a third recessed sidewallas3 w may be formed on the third adhesive layer as3. Since the wet etchprocess WE may be performed to remove the extensions ASe between thestack structures SS, third recess regions RS3 may be defined.

Referring to FIG. 23, the second molding layer 550 may be formed tocover the stack structures SS. The second molding layer 550 may beformed to fill the third recess regions RS3. The third recess regionsRS3 may have a substantially uniform shape and a relatively wide widthsuch that the molding composition of the second molding layer 550 mayfill the third recess regions RS3.

Referring to FIG. 24, the second molding layer 550 may be planarizeduntil exposing the third inactive surfaces 320 b of the thirdsemiconductor chips 320 and thus second molding patterns 555 may beformed. The carrier substrate CR may be detached from the packagesubstrate 100 by removing the adhesive mold MO from between the carriersubstrate CR and the package substrate 100. A cutting process may beperformed on the package substrate 100 to form a plurality ofsemiconductor packages. The cutting process may be performed using asecond blade BL2.

According to an exemplary embodiment of the present inventive concept,it may be possible to substantially completely remove the extension ASeof the adhesive structure AS that may be exposed to an outside. Thus,the adhesive structure AS may have no externally exposed extension ASeand may not display an irregular shape on a top surface of thesemiconductor package. It may also be possible to simplify removing theextension ASe of the adhesive structure AS because there is no need toform the first molding layer 500. The second molding pattern 555 mayhave a relatively low thermal expansion coefficient, and thus it may bepossible to reduce or eliminate heat-induced warpage of thesemiconductor package.

A semiconductor device according to an exemplary embodiment of thepresent inventive concept will be described in more detail below withreference to FIG. 24. Technical features described with reference toFIG. 24 may be substantially the same as technical features describedwith reference to FIG. 13, and thus duplicative descriptions may beomitted.

Referring back to FIG. 24, the adhesive structure AS may include thefirst to third adhesive layers as1, as2 and as3. The first to thirdadhesive layers as1, as2 and as3 may respectively substantially fill thefirst to third spaces SP1, SP2 and SP3. The first to third adhesivelayers as1, as2 and as3 may be separated and vertically spaced apartfrom each other.

The first to third adhesive layers as1, as2 and as3 may respectivelyinclude first to third recessed sidewalls as1 w, as2 w and as3 w. Thefirst to third recessed sidewalls as1 w, as2 w and as3 w may form arecessed sidewall ASw of the adhesive structure AS. The first to thirdrecessed sidewalls as1 w, as2 w and as3 w may be recessed toward theinterconnect members 112, 212 and 312, respectively.

The package substrate 100 may include a second molding pattern 555covering the stack structures SS. For example, the second moldingpattern 555 may be in direct contact with sidewalls of the first tothird semiconductor chips 120, 220 and 320. The second molding pattern555 may be in direct contact with the first to third recessed sidewallsas1 w, as2 w and as3 w. The second molding pattern 555 and the adhesivestructure AS may include different materials from each other. Forexample, the second molding pattern 555 may have a thermal expansioncoefficient different from that of the adhesive structure AS.

In a method for manufacturing a semiconductor device according to anexemplary embodiment of the present inventive concept, it may bepossible to effectively remove the extension of the adhesive structurecovering the semiconductor chips, which need not spoil the appearance ofthe semiconductor package. The molding layer may have a relatively lowthermal expansion coefficient and thus warpage of the semiconductorpackage may be reduced or eliminated.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the inventive concept.

1. A method for manufacturing a semiconductor device, the methodcomprising: stacking, on a package substrate, first semiconductor chipshorizontally spaced apart from each other, wherein each of the firstsemiconductor chips includes a first adhesive film facing the packagesubstrate; stacking, respectively, on the first semiconductor chips,second semiconductor chips horizontally spaced apart from each other,wherein each of the second semiconductor chips includes a secondadhesive film facing the first semiconductor chip; compressing the firstadhesive film and the second adhesive film to form an adhesivestructure, wherein the adhesive structure includes an extension disposedon sidewalls of the first semiconductor chip and sidewalls of the secondsemiconductor chip; removing the extension from the sidewalls of thesecond semiconductor chips; forming a first molding layer substantiallycovering the first and second semiconductor chips; and performing acutting process on the package substrate between the first and secondsemiconductor chips to form a plurality of semiconductor packages eachincluding at least one of the first semiconductor chips and at least oneof the second semiconductor chips.
 2. The method of claim 1, whereinforming the adhesive structure comprises: compressing the first adhesivefilm while stacking the first semiconductor chip to form a firstadhesive layer; and compressing the second adhesive film while stackingthe second semiconductor chip to form a second adhesive layer.
 3. Themethod of claim 1, wherein each of the first semiconductor chipscomprises at least one through via.
 4. The method of claim 3, whereineach of the second semiconductor chips further comprises at least oneinterconnect member, and wherein the at least one interconnect member iselectrically connected to the at least one through via when the secondsemiconductor chip is stacked.
 5. The method of claim 1, wherein thefirst adhesive film has a first thickness before the time when the firstsemiconductor chip is stacked, and wherein a first distance is achievedbetween the package substrate and the surface of the first semiconductorchip facing the package substrate after the time when the firstsemiconductor chip is stacked, the first thickness being greater thanthe first distance.
 6. The method of claim 1, further comprisingplanarizing the first molding layer until exposing top surfaces of thesecond semiconductor chips to form first molding patterns substantiallyfilling spaces between the second semiconductor chips.
 7. The method ofclaim 1, before removing the extension, further comprising forming asecond molding layer substantially covering the first and secondsemiconductor chips, wherein the second molding layer fills a spacebetween the second semiconductor chips adjacent to each other.
 8. Themethod of claim 7, wherein removing the extension comprises cutting thesecond molding layer between the second semiconductor chips adjacent toeach other.
 9. (canceled)
 10. The method of claim 7, wherein the firstmolding layer has a thermal expansion coefficient less than that of thesecond molding layer. 11-12. (canceled)
 13. The method of claim 1,wherein removing the extension comprises wet etching the extension byintroducing an etch solution into a space between the secondsemiconductor chips adjacent to each other. 14-15. (canceled)
 16. Amethod for manufacturing a semiconductor device, the method comprising:forming, on a package substrate, a plurality of stack structureshorizontally spaced apart from each other, each of the stack structuresincluding a plurality of semiconductor chips vertically stacked; formingadhesive structures respectively filling spaces between adjacent stackstructures of the plurality of stack structures; and removing at least aportion of the adhesive structure between the adjacent stack structures,wherein forming the stack structures and the adhesive structurescomprises sequentially stacking and compressing the plurality ofsemiconductor chips each including an adhesive film disposed on asurface of the semiconductor chip facing the package substrate.
 17. Themethod of claim 16, wherein the adhesive film is compressed when theplurality of semiconductor chips is stacked such that a fillet is formedon sidewalls of each of the semiconductor chips.
 18. The method of claim16, wherein at least one of the semiconductor chips of the plurality ofsemiconductor ships comprises: at least one through via penetrating theat least one semiconductor chip; and at least one interconnect memberthat is disposed on a surface of the semiconductor chip and electricallyconnected to the at least one through via, wherein the adhesive film isdisposed on the interconnect member.
 19. The method of claim 16, furthercomprising: forming a molding layer substantially covering the adhesivestructures; and cutting the molding layer between the adhesivestructures.
 20. The method of claim 16, wherein removing the at least aportion of the adhesive structure comprises wet etching the adhesivestructure by introducing an etch solution between the stack structures.21-24. (canceled)
 25. A method for manufacturing a semiconductor device,comprising: stacking a plurality of first semiconductor chips on apackage substrate, wherein the first semiconductor chips are spacedapart from each other on the package substrate, and wherein each of thefirst semiconductor chips comprises a first adhesive film; stacking asecond semiconductor chip of a plurality of second semiconductor chipson each of a corresponding one of the first semiconductor chips, whereineach of the second semiconductor chips comprises a second adhesive film;stacking a third semiconductor chip of a plurality of thirdsemiconductor chips on each of a corresponding one of the secondsemiconductor chips, wherein each of the third semiconductor chipscomprises a third adhesive film, wherein stacking the first, second andthird semiconductor chips forms a plurality of stacked structures spacedapart from each other on the package substrate, each of the stackedstructures including an adhesive structure comprising the first, secondand third adhesive films, and wherein the adhesive structure comprises aplurality of extensions disposed on sidewalls of respective ones of thefirst, second and third semiconductor chips; forming a first moldinglayer on upper surfaces of the plurality of third semiconductor chipsand on the plurality of extensions in spaces between adjacent stackedstructures of the plurality of stacked structures; removing the firstmolding layer between adjacent third semiconductor chips of theplurality of semiconductor chips; forming a second molding layer in eachof spaces formed by removing the first molding layer between adjacentthird semiconductor chips of the plurality of semiconductor chips; andseparating each of the stacked structures from each other by cuttingthrough the first and second molding layers and through the packagesubstrate between adjacent stacked structures of the plurality ofstacked structures.
 26. The method of claim 25, wherein the plurality ofextensions in the adhesive structure is formed by compressing each ofthe first, second and third semiconductor chips.
 27. The method of claim25, wherein the first, second and third semiconductor chips of each ofthe stacked structures is electrically connected to each other.
 28. Themethod of claim 27, wherein the first, second and third semiconductorchips of each of the stacked structures is electrically connected to aplurality of landing pads disposed on the package substrate.
 29. Themethod of claim 25, wherein the first molding layer has a thermalexpansion coefficient less than that of the second molding layer.